SMTS Device Modeling & Characterization

About this role

About GlobalFoundries   GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .     Summary of Role:   GlobalFoundries is seeking a motivated, self-driven engineer to be part of the Ultra-Low-Power CMOS modeling team in GlobalFoundries Bangalore. This team develops, among others, compact (SPICE) models of FDSOI, FinFET and Bulk MOSFETs which are part of the Process Design Kits (PDKs) offered by GF, which are used by customers to design products (chips) for use in various Digital/Analog and RF applications.     Any suitable candidate for this position should have completed their PhD or Masters in Electrical Engineering with emphasis on semiconductor physics or Microelectronics. Strong device physics knowledge is expected, especially in MOSFETs. Knowledge of Fully Depleted SOI and FinFET will be an added advantage. Knowledge of test structures needed for compact model extraction will be valuable. Any hands experience in process development and/or measurements & characterization will be an asset. Knowledge of BSIM families of compact models is a plus. Knowledge of model extraction tools (MBP/ICCAP) will also be a plus. Knowledge of high frequency (RF/MMW) characterization and modeling of MOSFETs will be highly desirable.     Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:  • Work closely with RF/MMW modeling team across sites and support critical customer engagements for RF/MMW applications.

• Analyze and represent semiconductor devices with industry standard models. 

• Applies knowledge of semiconductor physics to evaluate and analyze test results 

• Works closely with device and other modeling engineers to interpret test results and debug device and measurement issues 

• Prepares reports summarizing results or to make technical recommendations 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs  

• Work and collaborate other projects and/or assignments as needed 

   The candidate should be technically competent, highly self-motivated and should be capable of working in a fast paced dynamic environment, and have excellent communication and team skills. 

Essential Responsibilities: • Leads complex, strategic and business critical projects or initiatives for SPICE model development including  

• Design MOSFET characterization structures for compact model extraction 

• Develop Compact models for FDSOI, FinFET and Bulk technologies for RF/MMW applications 

• Develop Compact models for MRAM and RRAM 

• Deliver Model-to-HW correlation reports, K, CpK Analysis 

• Coaches and mentors team members; influences others as a technical leader. 

• Participates in and leads cross-functional teams across sites. 

• Limited and supervised contact at engineering and logistical level. 

• Chairs conference committees. 

• Provides guidance for external programs. 

• Initiates projects with suppliers in a very complex environment. 

• Serves as consortia project liaison. 

• Normally will report to a higher level executive, but may report to a peer level management executive. 

   Other Responsibilities:   • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs 

   Required Qualifications :  • PhD in Electrical or Electronics Engineering + 8 or more years of experience 

• Master’s in Electrical or Electronics Engineering + 12 or more years of experience 

    Preferred Qualifications:   • PhD  in Electrical or Electronics Engineering or Device Engineering

Expected Salary Range $118,000.00 - $210,000.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.  

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.  

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.  

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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