Senior Structural Analyst – Electronics Packaging - TeraWave

About this role

Application close date: Applications will be accepted on an ongoing basis until the requisition is closed. At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight!   

Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

We are seeking a  Senior Structural Analyst – Electronics Packaging  to serve as the structural analysis owner for one or more TeraWave satellite  Line Replaceable Units, LRUs , avionics enclosures, or electronics assemblies. In this role, you will hold end-to-end responsibility for the structural integrity of assigned hardware — from requirements definition and packaging concept through detailed analysis, environmental test, qualification, and production release. 

You will own the analysis of electronic boxes, card cages, printed circuit board assemblies, connectors, mounting features, fasteners, brackets, chassis, and internal retention features subjected to launch, handling, test, and on-orbit environments. You will work closely with mechanical design, electrical engineering, thermal engineering, manufacturing, test, and systems teams to ensure each LRU is robust, lightweight, producible, and ready for high-rate constellation deployment. 

Responsibilities (include but are not limited to):   • Own structural analysis for TeraWave satellite LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release. 

• Analyze electronics packaging hardware, including chassis, covers, mounting interfaces, card guides, wedge locks, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports. 

• Build and maintain detailed FEA and simplified analytical models using NASTRAN, ANSYS, Abaqus, or equivalent tools. 

• Verify strength, stiffness, modal response, vibration, shock, fatigue, thermal-mechanical performance, and load paths using FEA and classical methods such as Steinberg or Engelmaier. 

• Define structural environments, assumptions, boundary conditions, and interface loads with structures, systems, design, and test teams. 

• Assess margins of safety for enclosures, bolted joints, inserts, card retention features, solder joints, components, connectors, and mounting feet. 

• Support packaging trades for mass, stiffness, manufacturability, access, connector placement, card retention, and robustness. 

• Partner with mechanical design engineers to drive structural requirements into enclosure design, PCB layout, component placement, and mounting strategy. 

• Maintain structural interfaces, ICDs, analysis plans, model documentation, and verification artifacts. 

• Define structural test requirements and support qualification/acceptance testing, including vibration, shock, sine burst, modal, and environmental campaigns. 

• Correlate models to test data, investigate anomalies, and recommend design or process improvements. 

• Review supplier analyses and test data for compliance with Blue Origin and TeraWave requirements. 

• Author analysis reports, margin summaries, test plans, test reports, and certification documentation. 

• Present analysis results, risks, and recommendations at design, qualification, and production readiness reviews. 

• Mentor junior analysts and design engineers in electronics packaging analysis methods. 

• Develop repeatable analysis methods, templates, and allowables for high-rate satellite production. 

Minimum Qualifications   • Bachelor’s degree in Mechanical, Aerospace, Structural Engineering, or related field. 

• 8+ years of structural analysis experience with aerospace, spacecraft, launch vehicle, defense, or high-reliability hardware. 

• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware for vibration, shock, and thermal environments. 

• Proficiency with FEA tools such as NASTRAN, ANSYS, Abaqus, FEMAP, HyperMesh, or equivalent. 

• Strong knowledge of classical structural analysis, including bolted joints, fasteners, brackets, plates, beams, inserts, load paths, margins, and fatigue. 

• Experience with dynamic environments, including modal, random vibration, sine vibration, and shock. 

• Experience supporting qualification or acceptance testing, including planning, instrumentation, data review, model correlation, and anomaly resolution. 

• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. 

Preferred Qualifications   • Master’s or PhD in Mechanical, Aerospace, Structural Engineering, or related field. 

• 10+ years in spacecraft, satellite, launch vehicle, or high-reliability electronics packaging structural analysis. 

• Experience owning structural analysis for avionics enclosures, electronics LRUs, RF units, payload electronics, or similar flight hardware through qualification and production release. 

• Experience with PCB/CCA vibration analysis, component lead stress, solder fatigue, and electronics survivability methods such as Steinberg or Engelmaier. 

• Knowledge of spacecraft environmental requirements and qualification standards, including vibration, shock, TVAC, thermal cycling, and EMI/RFI considerations. 

• Familiarity with Bruhn, Roark’s, Shigley, Marks’, NASA standards, AIAA guidance, or equivalent references. 

• Experience with fatigue, fracture mechanics, cumulat

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