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Process Integration Engineer

Semtech

USA - Alhambra, CA, US$93k – $135konsite

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About this role

Location:   ​ Alhambra, CA ​  (Onsite)

Position Summary:   The Process Integration Engineer –   InP   Wafer Fab position   is responsible for   end-to-end ownership of Indium Phosphide ( InP ) wafer fabrication process flows supporting the manufacturing of DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip (GC) products. This role serves as the technical integrator across all wafer   fab   process modules, ensuring compatibility, robustness, and high-yield performance of the complete device fabrication flow .    The position focuses on cross-module coordination, yield analysis, failure analysis, and root-cause resolution to enable stable manufacturing operations and successful new product introduction. The role requires strong systems-level understanding of   InP   device fabrication, data-driven problem solving, and close collaboration with process, device, reliability, and manufacturing teams.  

Responsibilities :    

End-to-End Process Flow Ownership and Integration (35%) :  

• Own and manage the complete   InP   wafer fabrication process flow from epitaxy through backend processing  

• Ensure process compatibility and robust integration across lithography, etch, deposition, metallization, and test modules  

• Define and   maintain   integration requirements including layer interactions, thermal budgets, process margins, and sequence dependencies  

• Serve as the primary technical owner for process flow integrity and change impact assessment  

Yield Analysis, Excursion Response, and Continuous Improvement (25%) :  

• Lead yield analysis efforts to   identify   yield limiters, systematic defects, and process interactions  

• Drive excursion response activities, including rapid containment, root-cause identification, and corrective action implementation  

• Analyze inline and electrical test data to   identify   process trends and emerging risks  

• Partner with manufacturing and process teams to implement yield improvement and defect reduction initiatives  

Failure Analysis and Root-Cause Resolution (20%) :  

• Lead and coordinate failure analysis (FA) activities using structured problem-solving methodologies (e.g., 8D, Six Sigma)  

• Identify   defect mechanisms and process-induced failure modes through cross-functional investigation  

• Leverage FA techniques such as optical inspection, SEM, FIB, SIMS, and electrical analysis (directly or via partners)  

• Ensure corrective and preventive actions are implemented and verified for effectiveness  

New Product Introduction and Technology Support (10%) :  

• Support new product introduction (NPI), process transfers, and technology changes within the   InP   wafer   fab  

• Evaluate integration risks associated with   new designs , materials, or process changes  

• Collaborate with device and design teams to ensure manufacturability and integration robustness  

Documentation, Process Control, and Manufacturing Support (10%) :  

• Author and   maintain   process flows, integration specifications, travelers, and control plans  

• Define requirements for process control monitor structures (PCM/TLM) and ensure implementation in design layouts  

• Support day-to-day manufacturing operations by providing technical guidance and integration   expertise  

• Ensure documentation accuracy and compliance with internal quality and manufacturing standards  

Minimum Qualifications :  

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field   required  

• Minimum of 5+ years of experience in semiconductor process integration or device fabrication  

• Strong hands-on understanding of   InP -based or III-V compound semiconductor wafer fabrication processes  

• Demonstrated experience with yield analysis, defect reduction, and root-cause methodologies  

• Experience working across multiple wafer   fab   process modules in a manufacturing environment  

• Strong systems-level understanding of semiconductor device fabrication and process interactions  

• Proficiency   in data analysis and statistical process control (SPC)  

• Ability to drive alignment and decision-making across cross-functional engineering teams  

• Preferred experience with DFB lasers, SOAs, gain chips, or photonic device manufacturing  

• Familiarity with reliability testing, qualification flows, and product lifecycle support preferred  

• Experience supporting high-mix, low-volume manufacturing environments preferred  

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may   be required   to perform job-related tasks other than those specifically included in this description.  

All duties and responsibilities are essential   job   functions and requirements and are subject to   possible modification   to   reasonably accommodate   individuals with disabilities.  

A reasonable estimate of the pay range for this position is $93,000 - $135,000.  There are several factors taken into consideration in   determining   base salary, including but not limited to: job-related qualifications, skills,   education   and experience, as well as job location and the value of other elements of an employee’s total compensation package.  

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