Principal Plating Engineer

About this role

Job Profile: Engineer 4 Job Family: Engineering Time Type: Full time Apply before 11:59 PM Arizona time the day before the posted End Date.

Minimum Qualifications: Bachelor's degree and seven (7) years of experience appropriate to the area of assignment/field; OR, Any equivalent combination of experience and/or training from which comparable knowledge, skills and abilities have been achieved.

Job Profile Summary: Leads complex projects, and provides technical guidance, innovation, design, and expertise to enhance the institution's engineering solutions and infrastructure. May provide instruction/teaching. Job Description: Position Salary Range: • $135,000 - $175,000 per year; DOE

Job Description: The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a Principal Plating Engineer position. The candidate will mainly be focused on electroplating processing and will be expected to assist or provide backup to other areas. Primary areas of responsibility will include electroplating process development on our forthcoming 300mm wafer plating system as well as ownership of associated chemical metrology systems. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, and electrical test to ensure robust electroplating processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will maintain the electroplating process area by supporting operations and increasing equipment up time, responding to production issues, implementing solutions, reducing costs, and improving yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the Principal Plating Engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must.

This position is funded by DoD and requires candidates to meet the definition of US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.

Essential Duties: • Maintain electroplating equipment by supporting operations, increasing equipment up time, responding to production issues, keeping the equipment under statistical control, and reducing costs.

• Assist students, faculty, and other professionals with service requests

• Recommend, scope, and assist in the procurement and installation of future equipment into the Core.

• Cross-train in other areas to provide backup and assistance as needed.

• Write procedures to help students and other users safely use the equipment.

• Provide supervision and guidance to the users of the Core.

• Provide supervision to junior engineers.

• Regular activities include ability to quickly change priorities which may include and/or are subject to resolution of conflicts.

• Ability to clearly communicate and exchange accurate information to perform essential duties.

Desired Qualifications: • Master’s degree in engineering or related field and seven (7) years of engineering or related experience including responsibility for tool and process requirements; OR, any equivalent combination of experience and/or education from which comparable knowledge, skills and abilities have been achieved. • Preferred:

• MS in Chemical Engineering, Materials Engineering, Physics or related discipline

• Demonstrated understanding of the operation and maintenance of electroplating processing equipment

• Strong interpersonal, written and verbal communication skills

• Strong customer service skills

• Computer knowledge used for documentation and analysis.

• Demonstrated strong mechanical aptitude and experience with statistical software packages such as JMP or Minitab.

• Demonstrated experience with active matrix TFT processing and amorphous-silicon processes.

• Demonstrated experience with semiconductor advanced packaging processing.

• Experience with many disciplines including etching, deposition, cleaning, and other thin film processing.

• Equipment maintenance experience.

Working Environment: ASU is an inclusive enterprise with a wide variety of work and learning modes, locations, and a commitment to sustainability, innovation, and employee work-life balance. We are determined to maintain our position as an employer of choice in a competitive labor market, as such the following options may be offered dependent on department needs: Flexible work options: • Alternative work schedules can include four, 10-hour workdays in a workweek; a nine-day, 80-hour schedule over two workweeks for exempt employees only; and staggered start and stop times.

• Hybrid work is an arrangement where employees spend a minimum of 60% of their regular workweek at their primary ASU work location. Dean or vice president-level approval is required.

• Remote work is an arrangement where the employee spends less than 60% of their regular workweek at a regularly assigned ASU work location. Executive vice president-level approval is required.

Standard Working Environment: • Climate-controlled office setting subject to extended periods of being in a stationary position.

• Regular use of a computer and other office productivity equipment, such as a calculator, copy machine and printer.

• Ability to clearly communicate and exchange accurate information to perform essential duties.

• Expected to be responsive to customers; engaged in work production; and resourceful, flexible, and respectful of others.

Working Environment for research positions: • Regular activities require ability to manage multiple tasks at one time, to be abl

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