Principal, IC Digital Design Engineer

About this role

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

As a Principal, Digital IC Design Engineer at Marvell, you will join the DCE – Connectivity Business Group, the team developing the high performance connectivity silicon that underpins AI scale data centers for the world’s leading hyperscalers. Our group architects and implements advanced digital pipelines, high speed datapaths, and DSP driven processing engines that enable ultra high bandwidth, low latency data movement across next generation Ethernet and optical interconnects. You’ll work closely with experts in architecture, verification, physical design, and systems to deliver complex ASICs that integrate cutting edge DSP algorithms, robust protocol handling, and PHY level innovations. This role offers the opportunity to shape foundational connectivity technologies, drive technical direction, and contribute to silicon solutions powering the global AI infrastructure. What You Can Expect • Collaborate with systems and architecture teams to define SoC‑level specifications, including performance, power, area, feature requirements, and DSP/datapath architectural considerations. • Translate high‑level product and protocol requirements into detailed micro‑architecture specifications for complex subsystems, high‑speed datapaths, DSP pipelines, and IP blocks. • Own RTL development for assigned blocks, delivering high‑quality, synthesizable SystemVerilog RTL that meets functionality, performance, and power targets. • Implement and drive the full ASIC front‑end design flow , including lint, CDC/RDC, synthesis, timing constraint development, and design‑for‑test readiness. • Partner with STA and PNR teams to support timing closure, floorplanning, congestion analysis, and design optimizations across advanced process nodes. • Lead integration of digital logic into larger subsystems and top‑level assemblies, ensuring clean interfaces, modularity, and reusability. • Develop scalable and maintainable design components , including parameterized datapaths, DSP building blocks, and reusable infrastructure logic. • Work closely with DV teams to define verification strategies, review test plans, and ensure functional, coverage‑driven, and power‑aware validation of the design. • Support pre‑silicon validation , including emulation, FPGA prototyping, and performance modeling of high‑speed datapaths and DSP algorithms. • Drive post‑silicon bring‑up and debug , collaborating with lab and systems teams to validate functionality, characterize performance, and resolve complex issues across datapath, DSP, and protocol layers. • Participate in detailed design and micro‑architecture reviews , contributing to continuous improvement of design, verification, and methodology flows.

What We're Looking For • Extensive experience in digital ASIC design , including micro‑architecture development, RTL implementation (SystemVerilog preferred), and integration of complex logic blocks. • 12+ years of industry experience working on large‑scale ASICs for networking, data‑center connectivity, or high‑bandwidth compute architectures. • Strong background in high‑performance DSP and high‑speed datapath design , including pipelined arithmetic units, algorithm‑driven hardware implementation, packet processing engines, memory subsystems, and large‑scale control/state machines. • Familiarity with Ethernet protocols and networking standards , including MAC, PCS framing, flow control, and packet‑level behaviors. • Proficiency with front‑end design flows , including lint, CDC/RDC, synthesis, STA, and power/performance optimization. • Demonstrated ability to collaborate across architecture, verification, physical design, firmware, and systems teams , driving designs from concept through tape‑out. • Strong debug skills across RTL simulation, emulation, FPGA prototypes, and silicon bring‑up. • Familiarity with advanced process nodes (5nm, 3nm, or similar) and their implications for timing, power, and signal integrity. • Excellent communication and technical leadership skills , with the ability to influence design direction and drive execution. • BS/MS in Electrical Engineering, Computer Engineering, or related field ; PhD is a plus.

Preferred / Plus Skills • Advanced high‑speed DSP algorithm implementation , including adaptive equalization (FFE, DFE, CTLE), channel estimation, and high‑throughput filtering architectures. • Experience with FEC architectures such as LDPC, RS, BCH, or other high‑speed coding/decoding schemes used in networking and optical interconnects. • Previous PHY design experience , including PMA‑level DSP pipelines, equalization blocks, clock recovery, and SerDes‑adjacent logic.

Expected Base Pay Range (USD) 151,000 - 223,440, $ per annum The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements   Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help bal

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