Principal Engineer Microelectronic Semiconductors

About this role

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE REQUIRED FOR START: No

CLEARANCE TYPE: None

TRAVEL: Yes, 10% of the Time Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Principal Engineer Microelectronic Semiconductors Project Engineer – Surface Mount Technology

Northrop Grumman's Manufacturing Operations Engineering organization is seeking a Principal Engineer Microelectronic Semiconductors Project Engineer for the Surface Mount Technology Cell (SMT). This position is located both at our site near BWI Airport in Linthicum, Maryland, as well as our nearby Troy Hill complex in Elkridge, Maryland.

The Principal Engineer Microelectronic Semiconductors Project Engineer will be responsible for a product line, or group of product lines, moving through their respective areas, representing SMT manufacturing for programs, and managing technical development projects within SMT processes.

Responsibilities include: • Act as the main point of contact for manufacturing engineering related activities for your product within the cell.

• Collaborate closely with your process engineering peers as well as multiple other functional groups supporting shop floor, program office, and customer (quality engineering, manufacturing supervision, production, operations, design engineering, program management) to ensure manufacturing plans are defined and executed; leading efforts to remove obstacles and constraints to execution.

• Review, follow, and handle product on the shop floor.

• Coordinate between non-deliverable hardware requestor and manufacturing operations/engineering.

• Gather and document efforts related to non-recurring cost for initial product startup as well as support manufacturing readiness reviews.

• Lead communications outward from the shop floor, lead weekly meetings of various types for various audiences; yield meetings, situation reports, problem resolution charts, etc.

• Monitor metrics for product performance, quality, delivery, and cost; highlighting detractors and gathering resources to resolve them.

• Resolve technical manufacturing challenges related to materials, designs, equipment and tooling, training and instructions; collaborate with design engineers to resolve technical problems.

• Identify continuous improvement opportunities; create solutions and lobby for funding.

• Drive root cause corrective action efforts as issues arise.

• Specify new manufacturing equipment for production; lead deployment to ensure factory compliance and readiness for production.

• Identify new technologies that achieve required capabilities or capacities, develop ROI justification for technology deployments or process improvements.

• Create and manage project plans (tasks, resources and schedules) for process development activities and new equipment implementations.

• Document state-of-the-art process capabilities and guidelines for product designers.

The chosen candidate must be able to multi-task in a fast-paced, dynamic, high-visibility environment; work well in a team environment; and have excellent written and verbal communication skills.

This job may be filled as a Principal Engineer Microelectronic Semiconductors in the Project Engineer role based on the qualifications below.

Basic Qualifications for a Principal Engineer Microelectronic Semiconductors Project Engineer: • Bachelor's degree or higher in engineering or a related STEM field and at least (5) years of relevant work experience in Manufacturing/Process Engineering, Production, or related area, or a master’s degree in engineering or a related STEM field and at least (3) years of relevant work experience in Manufacturing/Process Engineering, Production, or related area. • Experience in a manufacturing environment. • Experience managing projects and/or leading people with strong organizational skills. • Candidate must be able to obtain/maintain a Secret security clearance. • U.S. citizenship.  • Ability to work at multiple sites.

Preferred Qualifications: • Experience with KPIs, cost estimates, work breakdown structures, and continuous improvement Project Management experience 

• Knowledge and experience with surface mount technology (SMT) and processes such as electronics assembly, epoxy dispensing and curing, conformal coating, thermal interface material dispense/application, soldering, mechanical assembly, Automated Optical Inspection, component/assembly test, etc.

• Strong organizational & project management skills • Familiarity with Design of Experiment (DOE), Statistical Process Control (SPC), and 6 sigma concepts for process development • Familiarity with J-STD and MIL-STD requirements 

MPR#

Primary Level Salary Range: $108,800.00 - $163,200.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow emplo

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