Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer

About this role

Job Details:

Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

The Role and Impact As a Manufacturing Failure Analysis Engineer, you will be instrumental in identifying and resolving failures in silicon, components, and systems, driving improvements in yield, quality, and reliability. On a day-to-day basis, you will define failure analysis strategies, perform hands-on lab evaluations, and thoroughly investigate electrical and mechanical characteristics to pinpoint root causes. Your work will directly contribute to advancing Intel's next-generation technologies and ensuring the success of future products.

Intel's Failure Analysis (FA) Lab in Chandler, Arizona is seeking a highly motivated AutoTEM/TEM Engineer to support high-volume manufacturing and yield improvement for advanced semiconductor technologies.

In this role, you will perform automated and manual transmission electron microscopy (AutoTEM/TEM) analysis, enabling rapid defect characterization, process learning, and root cause identification. You will work closely with FA, yield, and process engineering teams to deliver high-quality data and accelerate debug cycles.

This is an excellent opportunity for early-career engineers to develop expertise in advanced metrology, TEM workflows, and semiconductor failure analysis in a fast-paced production environment.

Business group Join Intel's manufacturing team, a vital part of our technology development and production organization. This group focuses on delivering world-class semiconductor solutions by driving innovation in manufacturing processes and product quality. Together, we enable cutting-edge advancements in computing and pave the way for Intel's global leadership in technology.

Key Responsibilities: • Operate AutoTEM and manual TEM workflows to support failure analysis and yield learning • Prepare and analyze TEM samples, including coordination with FIB/PFIB and SEM processes • Execute automated TEM job submissions and interpret results for engineering teams • Analyze imaging data to identify defects, process issues, and device structural differences • Partner with FA and yield teams to integrate TEM analysis into debug flows • Support high-volume lab operations, including prioritization, throughput, and turnaround time • Contribute to development and improvement of AutoTEM flows and best known methods (BKMs) • Assist with tool ownership activities such as monitoring tool health, troubleshooting, and continuous improvement • Maintain strong documentation of methods, results, and learnings

Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.

Minimum Qualifications: • Bachelor's degree in Engineering or Physics related field. • US citizenship required. • Ability to obtain and maintain a US Government Security Clearance.

Basic understanding in one of the following: •Semiconductor manufacturing processes and device physics or Materials characterization or Microscopy theory/experience.

Preferred Qualifications: • Proficiency in failure analysis tools and techniques, including electrical testing, microscopy, and material characterization. • Hands-on experience in failure analysis or quality assurance, with demonstrated skills gained through internships, academic projects, coursework, or hands-on training • Master's degree in a relevant field with no prior professional experience. • Exposure to microscopy, materials characterization, or lab-based work • Academic or industry experience with: o TEM, SEM, or FIB-based techniques o Semiconductor processing or failure analysis workflows

• Familiarity with data analysis and image interpretation • Knowledge of advanced node device structures or process integration • Experience working in a lab or high-volume manufacturing environment • Active US Government Security Clearance, with a minimum of Secret level

Behavioral Traits: • Strong attention to detail and data quality • Ability to work in a fast-paced, high-throughput lab environment • Effective communication and collaboration across cross-functional teams • Demonstrated ownership and willingness to learn new tools and techniques • Ability to balance multiple priorities and meet turnaround expectations

Step into a role where your expertise in understanding and solving complex challenges will make a tangible impact on Intel's groundbreaking technologies. Advance your career while contributing to shaping the future of computing-apply today.

Job Type: College Grad

Shift: Shift 1 (United States of America)

Primary Location: US, Arizona, Phoenix

Additional Locations:

Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits

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