Mechanical Engineer

About this role

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Job Description:

We are seeking a highly motivated Mechanical Engineer with expertise in system enclosure design and liquid cooling infrastructure to join our dynamic team at Broadcom’s CSG (Compute and Switching Group). The successful candidate will play a key role in the full hardware development cycle, from concept through NPI production, with a focus on high-power system enclosure design, system bring-up, and validation.

CSG develops advanced system-on-chip (SoC) devices for a wide variety of market segments. Our team designs reference and validation systems that enable customers to meet critical constraints in space, thermal management, manufacturability, and scalability. This is an exciting opportunity to help shape next-generation switch platforms and influence datacenter infrastructure at scale.

Responsibilities • Lead thermo-mechanical lab operations, including liquid cooling infrastructure, BGA socket thermal validation, and system-level testing.

• Own thermo-mechanical system component validation and troubleshooting, driving solutions from concept through production.

• Develop and qualify advanced thermal solutions (heatsinks, vapor chambers, liquid cooling, manifolds) through vendor collaboration.

• Conduct system-level thermal tests and correlate results with simulations.

• Define and execute thermal test plans, including documentation and data reporting.

• Design rack-mount enclosures and system components based on production requirements, collaborating with cross-functional teams (EE, thermal, compliance, manufacturing).

• Manage vendor relationships for thermal solution components (heatsinks, manifolds, fans, cooling hardware).

• Troubleshoot and resolve system-level thermal issues in high-power prototypes.

Qualifications • Bachelor’s degree in Mechanical Engineering or related field; 8+ years of experience in enclosure design and thermal test validation.

• Proficiency in PTC Creo and Windchill PLM (required).

• Strong background in heatsinks, heat pipes, vapor chambers, and liquid cooling systems.

• Hands-on experience with thermal measurement technologies, sensors, and lab instrumentation.

• Knowledge of datacenter rack standards (EIA-310, OCP).

• Familiarity with EMI/EMC shielding and compliance design considerations. Exposure to compliance and reliability testing (NEBS, shock/vibration, thermal cycling).

• Experience working with global contract manufacturers and suppliers to bring products from prototype to volume production.

• Experience with high-speed cabling design and routing (OSFP copper, optical, and internal cables, etc.), including bend-radius management, cable retention features, and serviceability within dense rack enclosures.

Compensation and Benefits

The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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