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Integrated Photonics Technical Leader - Acacia (Hybrid)

Cisco

Holmdel, NJ, US$172k – $245khybrid

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About this role

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received .

This is a hybrid role with three days per week at our Holmdel, NJ office.

Meet the Team Acacia, part of Cisco, is a market leader in high-speed coherent optical transceivers and a pioneer in coherent pluggable technology. Acacia’s coherent products are deployed by leading hyperscale cloud providers to connect data centers over distances ranging from a few kilometers to thousands of kilometers, including subsea networks.

The rapid growth of artificial intelligence infrastructure is substantially increasing demand for high-capacity optical interconnects. Acacia’s coherent technology is also being developed for space-based applications and, as interconnect speeds continue to increase, for emerging applications within data centers. In parallel, Acacia is expanding into the PAM4 client-optics market, including the development of 1.6 Tb/s PAM4 DSP solutions.

The Photonic Integrated Circuit, or PIC, team develops advanced photonic chips for optical communication products. The team works across silicon photonics, thin-film lithium niobate, or TFLN, and III–V material platforms, taking products from initial concepts through design, fabrication, characterization, qualification, and volume production.

Your Impact As a member of the PIC team, you will design, simulate, lay out, and characterize integrated photonic components and circuits for high-speed optical communication systems. You will collaborate closely with engineers working in silicon photonics, TFLN, and III–V technologies. Your responsibilities will span numerical modeling, foundry process development, production tapeouts, PIC characterization, failure analysis, design improvement, and production support. This role provides exposure to the complete commercial PIC development cycle—from device concepts and first prototypes to product qualification and high-volume manufacturing. You will also collaborate with millimeter-wave circuit designers, packaging engineers, module hardware and software teams, and optical test engineers to develop complete optical communication products. • Design passive and active integrated photonic components and circuits, including high-speed optoelectronic devices.

• Develop and validate numerical models using electromagnetic, optical, electrical, thermal, and multiphysics simulation methods.

• Create parameterized and script-based GDS layouts for photonic components, integrated circuits, and full product chips.

• Support photonic design reviews, foundry process development, mask preparation, design-rule verification, and production tapeouts.

• Plan and perform hands-on characterization of photonic components and circuits at the die, wafer, and assembled-device levels.

• Analyze measurement data and correlate experimental results with device models, process variations, packaging effects, and system-level performance.

• Work with cross-functional teams to transition PIC designs from prototype development into qualified commercial products.

• Provide technical support during product integration, qualification, manufacturing ramp, and volume production.

Minimum Qualifications: • Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related work experience, or equivalent related work experience.

• Experience in solid-state physics, integrated photonics, optoelectronics, and electromagnetic theory.

• Experience with the principles and practical application of numerical methods for photonic-device simulation.

• Experience using simulation tools such as FDTD, HFSS, COMSOL Multiphysics, or equivalent electromagnetic and multiphysics platforms.

• Experience with photonic-device fabrication processes and the relationship between fabrication tolerances and device performance.

• Experience with photonic-device layout, GDS generation, design-rule compliance, and tapeout.

Preferred Qualifications: • PhD with at least 5 years of relevant industry or applied research experience.

• Experience executing large-scale photonic integrated circuit tapeouts through commercial foundries.

• Experience designing and testing PICs for optical transceivers or high-speed optical interconnect systems.

• Experience designing, simulating, and characterizing high-speed optical modulators, photodetectors, or related optoelectronic devices.

• Experience with high-speed electronic-photonic co-design, including the interaction among device bandwidth, impedance, parasitics, packaging, and signal integrity.

• Experience integrating multiple material platforms, including silicon photonics, TFLN, III–V semiconductors, or other hybrid photonic technologies.

• Hands-on experience with optical component characterization, including wafer-level and die-level testing.

• Experience analyzing device yield, process variation, reliability, and manufacturing-test data.

• Experience with scripting or programming languages used for simulation automation, layout generation, test automation, and data analysis.

Why Cisco?  At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.  We are Cisco, and our power starts with you. 

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