Electronics Parts, Materials, and Processes Engineer - Advanced Packaging

About this role

The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space— delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you’ll be part of a special collection of problem solvers, thought leaders, and innovators. Join us and take your place in space.

At the Mission Payloads Division (MPD), we are pioneers in remote sensing systems that guide our country’s space enterprise. Our talented and dynamic people create and flourish in electronics, sensors, radar, artificial intelligence (AI), and advanced data network domains. We boldly advance technology through our research and development and then forward to demonstration and integration .   With innovative laboratories and prototyping, MPD delivers groundbreaking results. We guide our Department of Defense, intelligence community, and civil clients to enhance national productivity and security and tackle the most critical missions .  Bring your intelligence and creative spirit and join us at MPD!  

The Parts, Materials & Processes Department (PMPD) includes subject matter experts across a broad range of areas pertaining to electrical, electronic, and electromechanical (EEE) parts procurement, qualification, application, root cause failure analysis, as well as materials and processes. Our expertise combined with a sophisticated in-house electronic component laboratory deliver innovative analysis and PM&P program management capabilities to national space systems and civil customers.   

PMPD is seeking   an    Electronics   P arts,   M aterials, and   P rocesses   Engineer - Advanced Packaging   (Engineering Specialist - M icroelectronics / Semiconductor Engineering ) with   proficiency   in   packaging, assembly, and testing , related procurement standards,   related   control boards for program management and adjudication of nonconformities.  

This position is based in El Segundo, CA and requires a minimum of   four   days   per week in office .  

What You’ll Be Doing  

• Supporting parts, materials, and processes (PM&P) program management functions which include   – PM&P   selection   commensurate   with application risk tolerance,   control boards, design reviews, and manufacturing readiness reviews  

• Provide ongoing technical consultation and advice to management, internal/external customers, and contractors on the evaluation,   selection , and use of a dvanced semiconductor packaging   ( e.g., 2.5/3D ,   system in package, multi-chip   module)   for space   and missile   applications  

• May lead cross-organizational teams and organize interfaces within department  

• Collaborate with industry colleagues, and   component   supplier personnel to create/ maintain   guidance and requirements related to selection, screening, qualification,   and root cause   failure analysis  

• Act as organization’s designated representative at technical meetings, presentation, and workshops  

• Mentor less experienced staff – as required – and serve as role model  

What You Need to be Successful  

Minimum Requirements:  

• Bachelor’s degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline   

• At least eight years of increasingly responsible and related engineering/scientific experience (time spent obtaining advanced degree counts towards this).  

• Proficiency   in industry PMP requirements standards   development   for   advanced   semiconductor packaging   – including related, component selection, assembly materials, and processes (PMP), and selection of elements  

• Experience supporting parts, materials, and processes (PM&P) program management functions which include -- control boards, design reviews, and manufacturing readiness reviews  

• Excellent record of customer communication and interaction  

• Willingness to travel [domestically/internationally] approx. 25% of time  

• This position requires ability to obtain and maintain a TS/SSBI security clearance, which is issued by the US government. U.S citizenship is required to obtain a security clearance.  

How You Can Stand Out     

It would be impressive if you have one or more of these:  

• Advanced degree from an accredited university in materials science, electrical engineering, physics, or another appropriate discipline    

• 8+ years of experience in a dvanced semiconductor packaging   (time spent obtaining advanced degree counts towards this).  

• Experience leading/managing teams to evaluate, select, and qualify electronic parts, materials, and processes (PMP) for space-related applications while balancing risks  

• Demonstrated ability to assess non-MIL PRF parts and develop appropriate methods for use in space and related high-reliability applications  

• Hold an active TS/SSBI security clearance  

• Proficiency in common root cause analysis tools during problem resolution  

• Experience collaborating with contractors, industry working groups, and/or associations such as NASA Electronics Parts Assurance Group, Defense Logistics Agency, Joint Electron Device Engineering Council, Automotive Electronics Council, during the evaluation, selection, and adaptation of active electronic parts for space-related applications]   

• Possess project management skills in applications such as MS Project,   Jira , etc.  

We offer a competitive compensation package where you’ll be rewarded based on your performance and recognized for the value you bring to our business.  The grade-based pay range for this job is listed below.  Individual salaries within that range are determined through a wide variety of factors including but not limited to education, experience, knowledge a

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