​​Backend Process Engineer​

About this role

Location:   ​ Alhambra, CA ​  

Position Summary:   The Backend Process Engineer –   InP   Wafer Fab position   is responsible for   development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide ( InP )–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA),   and   automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.  

Responsibilities :    

Backend Process Ownership and Optimization (35%) :  

• Own and   optimize   backend wafer   fab   processes including lapping/thinning, n-side metallization, and RTA  

• Establish robust process windows, recipes, and control limits for backend modules  

• Maintain stable manufacturing performance through continuous monitoring and improvement  

Yield Improvement, Defect Reduction, and AOI Control (25%) :  

• Own and maintain AOI processes for backend defect detection and yield monitoring  

• Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations  

• Analyze inline and post-process data to   identify   trends and systematic issues  

• Implement corrective and preventive actions and verify effectiveness  

Singulation,   Optical   Coatings, and Packaging Interface Support (20%) :  

• Support cleaving, dicing, and singulation processes to ensure device integrity  

• Provide process engineering support for AR/HR optical coatings and vendor qualifications  

• Collaborate with packaging, device, and reliability teams to ensure packaging readiness  

New Product Introduction and Technology Support (10%) :  

• Support new product introduction (NPI), process transfers, and technology changes  

• Evaluate backend process risks associated with   new designs , materials, and device structures  

Documentation, Process Control, and Manufacturing Support (10%)  

• Author and   maintain   SOPs, travelers, process specifications, and control plans  

• Define SPC metrics and control strategies for backend processes  

• Provide hands-on manufacturing and troubleshooting support as needed  

Minimum Qualifications :  

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field  

• Minimum of 3+ years of experience in   backend semiconductor processing  

• Hands-on experience with lapping/thinning, metallization, and thermal processes   

• U nderstanding of   InP -based or III-V compound semiconductor wafer fabrication processes  

• Experience with AOI systems, yield analysis, and data-driven process improvement

• Strong understanding of singulation, packaging interfaces, and reliability requirements  

• Proficiency   in SPC, DOE, and statistical analysis  

• Ability to work across cross-functional manufacturing and engineering teams  

• Preferred experience with   InP   or III-V optoelectronic devices  

• Familiarity with AR/HR optical coating processes  

• Experience supporting high-mix, low-volume manufacturing environments preferred  

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may   be required   to perform job-related tasks other than those specifically included in this description.  

All duties and responsibilities are essential   job   functions and requirements and are subject to   possible modification   to   reasonably accommodate   individuals with disabilities.  

A reasonable estimate of the pay range for this position is $100,000 - $135,000.  There are several factors taken into consideration in   determining   base salary, including but not limited to: job-related qualifications, skills,   education   and experience, as well as job location and the value of other elements of an employee’s total compensation package.  

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